WS300 series wafer cleaning system can clean all of semiconductor products, especially after dicing process.
End user can use multi cleaning sequences to keep thestability and productivity.
And choose the option - contact cleaning arm to improve the quality.
• Fully Auto / Semi Auto
• Atomizing cleaning nozzle
• Customization C/T (Frame Max Size : 400 x 400 mm)
• 10 sets of recipe saving
• FOUP / FOSB Load Port(Option)
• HEPA(Option)
• Coating function(Option)
• Frame scan(Fully Auto)
WS300系列晶圓/晶片清洗機採全自動或半自動模式來清洗切割後的產品,可⾃⾏設定所需的清洗程序來維持穩定的清洗品質及效率。除了可使用水氣二流體噴嘴,也另外可選配⽑刷或海綿來提升清潔的效果及品質。
可依客戶需求客製特殊清洗模式,如: Wafer邊緣清洗、裸片清洗、表面塗布 ( Spin coating )……等
如需進一步的相關資料,請來信至:info@ntl.com.tw